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2026-09-01
President Lai attends 2026 EU Investment Forum

On the afternoon of September 1, President Lai Ching-te attended the opening of the 2026 European Union Investment Forum. In remarks, President Lai said that Taiwan and Europe are becoming economically closer and that Taiwanese companies are investing in Europe at a larger scale. The president expressed hope that in the face of global industrial competition and the restructuring of supply chains, Taiwan and Europe can combine their advantages in semiconductors and deepen their strategic partnership, and that they can work toward agreements on double taxation and investment so that together, they can build a global supply chain that is more secure, diverse, and resilient.

A transcript of President Lai’s remarks follows:

It’s a pleasure to join you all at [the] EU Investment Forum. I would like to thank the organizers and all [the] participants from Europe and Taiwan.

Taiwan and Europe have become economically closer over the years. Last year, bilateral trade with [the] EU reached almost US$75 billion, making the EU Taiwan’s fifth largest trading partner. Over the last decade, Taiwanese investment in the EU surged by 650 percent, compared with the decade before.

We are very happy to hear the recent announcement from TEEMA [Taiwan Electrical and Electronic Manufacturers’ Association] about establishing a technology park in Poland. In the future, it will be easier for Taiwanese [companies] to invest in [the] EU and cooperate with local industries.

All this showcases our robust economic ties. It also indicates that Taiwanese companies are not just focused on individual investment projects. More and more, they’re taking an integrated approach to investment in Europe, with a longer time frame and larger scale. 

We also look forward to more opportunities for Taiwan-Europe cooperation in global technology. On that note, SEMICON Taiwan 2026 kicks off tomorrow. It will bring together leading semiconductor and tech companies, to explore opportunities in AI chips and advanced packaging.

Across the globe, countries are boosting their industrial capabilities. In June, the European Commission announced [the draft] Chips Act 2.0, which aims to speed up commercialization, and bring chips to the market faster. It shows that Europe is determined to build a more competitive chip industry and make its supply chains more resilient.

Taiwan and Europe each have unique advantages in semiconductors. Taiwan already has a highly integrated industrial ecosystem. And Europe offers world-class capabilities in R&D, equipment, materials, and high value-added manufacturing. By combining our advantages, and building a strategic partnership, we can create even greater shared value. Together, we can shape a global semiconductor ecosystem that is more secure, diverse, and resilient.

We hope the European nations will promote agreements on double taxation and investment with Taiwan. This will help unlock our immense potential for investment and industrial cooperation. Looking ahead, Taiwan will keep working closely with Europe to build stronger supply chains, and more resilient economies. Together, we will contribute even more to global prosperity and sustainable development.

To close, I wish this event great success. I’m confident your discussions today will open up more opportunities for cooperation between Taiwan and Europe. I also hope your innovative ideas lead to concrete investments, bringing fruitful outcomes for all of us. Thank you.

Also in attendance at the event was Head of the European Economic and Trade Office Lutz Güllner.

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